Silicon Labs' IoT SoC Gambit
News & Analysis 3/31/2014 11 comments
Silicon Labs' CEO came to Shanghai and captured the audience's imagination with a slide labeled "IoT SoC." Though it did not show the real chip, it illustrated the IoT in tangible terms.
Samsung, Intel Lead Chip Capex Ranking
News & Analysis 3/27/2014 4 comments
While SanDisk and Micron are expected to increase their capital spending in 2014, Samsung and Intel are still expected to remain the two biggest spenders during the next 12 months.
Topological Insulators Boost Spintronic Devices
News & Analysis 3/21/2014 3 comments
In a new paper, researchers from three different universities detailed a new way to control the surface electronic states of TIs. Eventually, this could lead to their use in a range of spintronic devices.
Android User Lawsuit Highlights Personal Data Perils
News & Analysis 3/19/2014 6 comments
In a 2013 lawsuit, Android users claimed that Google had gained access to personal information from their smartphones and tablets and then gave it to a third party. These users claim that they never gave permission for this, highlighting the perils of having personal information on mobile devices.
Exclusive: Xiaomi Challenged
News & Analysis 3/19/2014 3 comments
Even for Xiaomi, the box business hasn't exactly been a cakewalk. The Chinese company had to scramble for a modicum of cooperation from parts and components suppliers.
Exclusive: Xiaomi Unboxed
News & Analysis 3/18/2014 20 comments
China's Xiaomi Inc., with no prior experience in the CE business, has picked up where Sony, Motorola, and Nokia left off and has blazed a path to survival in today's cutthroat consumer market.
1TB Archive Disc Avoids Format War
News & Analysis 3/17/2014 2 comments
Sony and Panasonic are developing new disk storage technology that can store up to a terabyte of data on a disk, and the two companies are doing it without a fight.
What's in an Airplane's Black Box?
News & Analysis 3/17/2014 16 comments
In the end, it all comes down to the memory. I spoke to EDN (our sister site) contributing editor Nicole Faubert last week, and she was wondering what electronics were inside the important black box.
DDR4 Heir-Apparent Makes Progress
News & Analysis 3/11/2014 16 comments
The final second-generation specification for Hybrid Memory Cube is expected in May, just as DDR4 is poised for wider adoption in servers. But a memory wall awaits, and HMC is its most likely replacement.
Marvell to Launch IoT Maker Kit
News & Analysis 3/10/2014 17 comments
Spin Waves Cut Logic Power
News & Analysis 3/7/2014 7 comments
In a new research paper, UCLA scientists explain how they used electron spin to slash the power consumption of logic devices.
Showtime for the Micron-Sony 16Gb ReRAM
Blog 3/4/2014 20 comments
New 16Gbit ReRAM is an impressive piece of design and a clear demonstration of lithographic and fabrication skills, yet absence of important details suggests the appearance of this device in standard product form is still some way ahead.
Research Suggests New Class of Magnetic Materials
Blog 3/3/2014 2 comments
An international team of scientists led by University of York claims to have paved the way for a new class of magnetic materials and devices that promise energy-efficient thermally induced switching and offer improved performance and power efficiency.
RONNIEE Card Shares Memory Across Networks
News & Analysis 3/3/2014 Post a comment
Startup A3Cube's intelligent fabric blurs the lines between network and memory architectures to improve I/O performance and latency as placing applications closer to memory becomes increasingly common.
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