Four Big Trends to Watch at CES 2018
News & Analysis 12/18/2017 Post a comment
The factors that distinguish CES 2018 from last year are the pervasiveness of AI, connectivity and software platforms. A broader theme is how all these technologies, once they get connected, will alter consumers’ perception of reality.
Karamba Says It Can Protect CAN
News & Analysis 12/13/2017 4 comments
Thus far, Trillium has been the sole voice promoting 30-year-old CAN bus protection. Now Karamba Security is in the game, claiming it better because SafeCAN authenticates a CAN bus-based network with “zero network overhead.”
IoT Markets to Watch in 2018
Blog 12/13/2017 1 comment
Predictive maintenance and asset tracking are two big IoT markets to watch in 2018 because they will provide real efficiencies and improved safety.
ST, Ams Sense 3D Trend
News & Analysis 12/13/2017 4 comments
ST and Ams have identified 3D sensing as the biggest growth segment in sensors. To frame their success as a lucky break induced by iPhone X would be an understatement. Both are boldly taking on the complex technology challenges.
Redpine Flexes ‘Lowest-Power’ Wireless MCU
News & Analysis 12/12/2017 Post a comment
Redpine is rolling out the industry’s lowest-power wireless combo solution featuring advanced security with integrated Bluetooth 5, dual-band Wi-Fi, 802.15.4/ZigBee/Thread, for battery-operated IoT applications
Time to Rethink Computer Vision
Blog 12/11/2017 1 comment
Today, computers are fast becoming the world’s largest consumers of images, and yet, this is not reflected in the way that images are captured.
National Security vs. Job Creation
Blog 12/8/2017 1 comment
In the U.S., CFIUS is bringing new levels of scrutiny to M&A’s, especially those involving foreign capital. But national security needs to be balanced with the benefits of investment capital coming into the country.
Intel’s EyeQ 5 vs. Nvidia’s Xavier: Wrong Debate
News & Analysis 12/6/2017 2 comments
The specsmanship battle by Nvidia and Intel over AI chips reached a new high, when Intel CEO claimed EyeQ 5 “can deliver more than twice the deep-learning performance efficiency” than Xavier SoC. Nvidia called us and cried foul.
4DS Enlists IMEC to Advance ReRAM
News & Analysis 12/1/2017 1 comment
Collaboration aims to demonstrate 4DS' production back-end-of-line process on IMEC's CMOS megabit memory vehicle processed at 300mm wafers to make 1Mb devices
Velodyne Pads Lead in Lidar Derby
News & Analysis 11/29/2017 1 comment
Velodyne LiDAR is still lapping the field in an embryonic but increasingly competitive lidar market, an advantage that grew when it unveiled a new 128-channel lidar sensor. The VLS-128 boasts range and resolution that other lidars have not offered.
RISC-V Spins into Drives, AI
News & Analysis 11/28/2017 5 comments
Western Digital and startup Esperanto tipped plans for storage and machine-learning chips using the open-source RISC-V architecture.
CEA-Leti Moves Fast on New CEO
News & Analysis 11/28/2017 3 comments
CEA-Leti, one of the largest micro- and nanotechnologies research institutes in Europe, lost its head recently, but recovered by naming Emmanuel Sabonnadiere as CEO, succeeding Marie-Noëlle Semeria. CEA-Leti has provided no explanation of Semeria’s contract non-renewal.
IoT Skill Shortage Ahead
Blog 11/28/2017 3 comments
The growing Internet of Things is opening up a new range of jobs that require specific IoT skills--and we’re already seeing a shortage of qualified candidates.
MEMS Design Shrinks Speakers to Chip Scale
News & Analysis 11/22/2017 3 comments
USound has developed microelectromechanical system (MEMS) chip-scale audio speakers, targeting in- and over-ear high-fidelity earbuds, smartphones, multidriver headphones, and other IoT wearables.
Inside 5 AR/VR Headsets
Blog 11/22/2017 2 comments
Augmented and virtual reality headsets will see use in companies faster than in our living rooms, but that’s not stopping developers from pushing the limits to woo consumers.
Samsung Likely to Unseat Intel as Top Chip Vendor
News & Analysis 11/22/2017 6 comments
Samsung, which has nearly half of the global DRAM market, is likely to crush smaller rivals after more than doubling its plan for capital expenditures in its semiconductor unit for this year, according to market analyst IC Insights.
Qualcomm, China Mobile, ZTE Show 5G Data Interoperability
Blog 11/21/2017 1 comment
A 5G interoperability test system developed by Qualcomm, ZTE and China Mobile, combined with the pending development of the first 3GPP 5G-NR standard, are good indicators of the pending frenzy over 5G; it’s a good time to take a Boot Camp course on 5G.
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