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posted in June 2011
Sensor module design improves automotive electrical integration, functionality (Part 2)
Design How-To  
6/30/2011   Post a comment
Devices must be reliable and robust, and operate with long-term stability and high precision under harsh physical, chemical, and electrical stress conditions.
Thin Film offers passive plastic NVM
News & Analysis  
6/30/2011   2 comments
Printed plastic memory pioneer Thin Film Electronics ASA has announced the development of a passive array nonvolatile printable plastic memory that is describes as being suitable for secure documents.
IBM reports drift-tolerant multilevel cell PCM
6/30/2011   26 comments
Scientists at IBM Research in Zurich, Switzerland, have reported a method to store multiple bits reliably in a phase-change memory cell.
Boundary conditions dictate battery management
Design How-To  
6/30/2011   2 comments
Once cell and electronics architecture is understood, one must consider tradeoffs in circuit topology such as how to optimize communications and interconnection within battery pack.
Researchers look at typing as power source
6/29/2011   17 comments
Researchers in Australia have been looking at whether typing could be used to recharge electronic equipment. If their findings can be scaled up then chargers could be relegated to emergency use only.
Energy efficiency may require 'cool factor'
News & Analysis  
6/28/2011   27 comments
The Smart Energy Panel at the Freescale Technology Forum addressed the issue of smarter energy efficiency by asking its panelists to expound on the question: What is the biggest hurdle to action?
Nanoelectronics body doubles 2011 funds to $250-million
6/28/2011   9 comments
The ENIAC Joint Undertaking, a European public-private partnership for the funding of nanoelectronics research in Europe, has said the amount of money available through the latest call for proposals includes grants totaling 175 million euro (about $250 million) an increase of 100 percent on 2010.
Adapt low-band ISM transmitters for high-band operation
Design How-To  
6/28/2011   5 comments
The article specifically discusses a series of tests and analyzes how much power can be transmitted at 868MHz from one or more of the ISM-band RF transmitters designed for the 300MHz to 450MHz range.
Sensor module design improves automotive electrical integration, functionality (Part 1)
Design How-To  
6/24/2011   Post a comment
Devices must be reliable and robust, and operate with long-term stability and high precision under harsh physical, chemical, and electrical stress conditions.
PLX, Avago demo PCI Express over fiber
News & Analysis  
6/21/2011   Post a comment
Chip makers PLX Technology and Avago Technologies announced a collaboration using optics to demonstrate PCI Express extending beyond its dominant role within the box to a cabled box-to-box solution.
Sensors: More than MEMS
6/21/2011   2 comments
The fact that I spend too much time focusing on consumer electronics was brought home to me vividly by a visit to the recent Sensors Expo 2011 in Chicago. Far from the niche show that I expected, it was swamped by over 4,000 attendees checking out 140 exhibiting companies, making navigating the aisles a good application for GPS, LIDAR, a 3-axis accelerometer and a collision-avoidance system.
Nanotubes not toxic, researchers say
News & Analysis  
6/20/2011   9 comments
Nanotubes may not be toxic, after all, according to a study that blames contaminants mixed in during their manufacture for their adverse health effects.
Photo gallery: EVs begin to drive a 'green' economy
News & Analysis  
6/20/2011   15 comments
An energy fair spotlights the electric vehicle infrastructure and a more comprehensive approach to green building techniques.
If you can't drive a Chevy Volt, drive a plug-in Prius
6/17/2011   38 comments
The Prius Plug-In Hybrid is the car I'm driving for a week. Give me any questions or comments you may have.
ECU architecture ensures failure safety
Design How-To  
6/17/2011   3 comments
The complexity of automotive mechatronic systems makes it impossible to fully determine all potential failure modes or to test all possible behavior. The challenge is to architect control units in a way that dangerous failures are prevented or at least sufficiently controlled.
ST FingerTip Touchscreen technology stifles electrical ‘noise’
Product News  
6/16/2011   Post a comment
STMicroelectronics announced its new FingerTip technology, which enables a single-chip solution for capacitive touchscreens up to 10 inches in diameter with multi-touch capability.
IMEC benchmarks FinFET superiority
6/16/2011   2 comments
The IMEC research institute has compared one planar and two FinFET technologies to see how they perform against scaling and process variability.
Why AMD is opening up Fusion...
6/16/2011   6 comments
The transition to many-core processing is going be accompanied by a step up in abstraction. As CPU and GPU become the new chip building blocks AMD is trying to take the higher ground with is Fusion System Architecture.
AMD-authored OpenCL textbook due in August
6/15/2011   1 comment
Advanced Micro Devices Inc. has collaborated with Northeastern University on the preparation of a book entitled Heterogeneous Computing with OpenCL that is due to be published by Morgan Kaufmann in August 2011.
MEMS for biomedical can do far more than simply "sense"
News & Analysis  
6/15/2011   4 comments
Relatively large structures and microactuators are also viable medical MEMS components
Neul opens up on 'white space' radio network
News & Analysis  
6/14/2011   2 comments
Neul Ltd. has announced some more details of its first white-space radio network called Neulnet and the standard behind that Neul has dubbed Weightless.
Peering inside a portable, $200 cancer detector, Part 1
Design How-To  
6/13/2011   2 comments
Harvard University and Massachusetts General Hospital have developed a small, inexpensive cancer-detection device; here are the design and construction details
Software and hardware challenges due to the dynamic raw NAND market
Design How-To  
6/12/2011   7 comments
In this stellar article, Allred and Agarwal lay out the different non-volatile memory technologies, issues with NAND, and potential ways forward.
CMOS PAs improve RF performance and save BOM for 3G mobile handsets
Design How-To  
6/11/2011   5 comments
For increased market success, it is necessary for CMOS PAs not only to deliver lower system cost, but also to outperform GaAs PAs on important system metrics.
Impressions of IMS2011
RF & Microwave Designline Blog  
6/11/2011   1 comment
Basestations, Backhaul, and Radar
'Bit-Reshaper' corrects FlexRay timing errors
Design How-To  
6/10/2011   1 comment
EMI susceptibility and signal quality issues with complex topologies have prevented a breakthrough of the FlexRay automotive data bus. But here's how to correct bit timing mismatches and significantly improve overall signal quality in FlexRay networks.
Tech Trends: Customer engagement puts the Digital Consumer in the driver's seat
Design How-To  
6/10/2011   Post a comment
Digital Consumer is armed with many brand and product choices. While various industries have adapted their customer engagement strategies to engage the Digital Consumer, the automotive customer journey remains a path of multiple years, players, and disjointed interactions. But, in fact, the vehicle just might be the most important digital consumer domain.
Kovio raises $15 million for printed NFC
News & Analysis  
6/9/2011   2 comments
Kovio, a private company developing manufacturing technology that combines graphics printing with silicon-based circuitry, has raised $15 million to pursue NFC applications in a round of funding led by Tyco Retail Solutions.
Intel tips second university research center
News & Analysis  
6/7/2011   7 comments
The second Intel Science and Technology Center—part of a commitment by the company to pump $100 million into U.S. university research over the next five years—will focus on secure computing and will be hosted at the University of California-Berkeley in collaboration with several other universities, Intel said.
Qualcomm backs embedded MEMS firm Cavendish
News & Analysis  
6/7/2011   4 comments
Qualcomm has joined investors backing Cavendish Kinetics, a fabless company that offers MEMS embedded in CMOS to create tunable devices for RF applications.
MEMS device radically reshapes IR non-contact temperature sensing for consumer products
Product News  
6/6/2011   9 comments
TMP006 from Texas Instruments is complete infrared subsystem with thermopile, conditioning, ADC, references, and digital interface in 1.6 mm-square package
Piezoelectric fans and their application In electronics cooling
Design How-To  
6/6/2011   9 comments
Understand how this "air mover" works and can provide cooling benefits in challenging thermal situations.
Benchmark automotive network applications
Design How-To  
6/3/2011   Post a comment
Validate and test new technologies against automotive requirements.
Samsung's 27-nm NAND flash in pictures
6/3/2011   5 comments
Engineering services company UBM TechInsights has found examples of the Samsung 27-nm NAND flash memory in the field and taken photographs.
EcoCAR forms a project-based learning platform
Design How-To  
6/2/2011   Post a comment
Real-world development program inspires engineering students to extend their knowledge of advanced vehicle technologies.
Nanoscale waveguide boosts silicon photonics
News & Analysis  
6/2/2011   4 comments
Berkeley Lab has invented a new quasiparticle called the "hybrid plasmon polariton" which it claims solves the problem of optical losses in silicon waveguides.
Pick the best Engineering Investigations piece
Engineering Investigations  
6/1/2011   6 comments
We've been around the world, drunk Calvados in exotic locations, waded knee-deep in exploding mice, ground our teeth at management ineptitude and learned the value of teamwork. Now, it's time to help determine the best of the latest Engineering Investigations blog submissions!
Rusnano draws MEMS firm to Russia
News & Analysis  
6/1/2011   3 comments
Rusnano, the Russian government investment fund for nanotechnologies, has said it is investing $15 million into a $22 million project with MEMS-based timing company SiTime Corp. under which the company will open up a development center in Russia.
Energy harvesting tipping point for wireless sensor applications
Design How-To  
6/1/2011   6 comments
Among the final pieces in the energy harvesting solution jigsaw puzzle are integrated circuits that can perform useful functions, such as algorithmic control and wireless communications using tiny amounts of energy.
Singapore institute to make 4DS 16-kbit RRAM
News & Analysis  
6/1/2011   4 comments
The Data Storage Institute of Singapore is going to help 4DS make a prototype non-volatile 16-kbit resistive random access memory.

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Aloha from EEWeb
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Just a few minutes ago as I pen these words, I posted this blog about this month's Cartoon Punchline Competition over on