ARM Describes 10nm Test Chip
News & Analysis 5/18/2016 3 comments
ARM taped out a 10nm FinFET test chip in January at TSMC and expects similar SoCs will be in handsets by the end of the year, using the process it described as relatively expensive and focused on lowering power.
Building Multi-Port USB Type-C Adapters for Power
Blog 5/17/2016 Post a comment
In the a previous blog, we discussed some of the challenges when designing AC/DC adapters for USB Type-C power delivery (PD). In that article, we focused on an adapter with a single Type-C output connector. In this article, we’ll examine the complexities introduced when architecting a multi-port Type-C adapter.
Samsung Details Foundry Roadmap
News & Analysis 4/22/2016 3 comments
Officials from Samsung Semiconductor Inc. detailed the company’s foundry roadmap, which includes expanding FD-SOI production and offering low-cost alternatives to existing FinFET technologies.
NI's mmW Radio Speeds 5G Research
News & Analysis 4/21/2016 1 comment
National Instruments announced a software defined radio for the millimeter wave spectrum. The transceiver system that can transmit and/or receive wide-bandwidth signals at 2 GHz real-time bandwidth, covering the 71-76 GHz spectrum. The system comes with accompanying software.
Ams Breaks Ground on N.Y. Fab
News & Analysis 4/20/2016 1 comment
AMS AG broke ground on a wafer fab in upstate New York today, joining the ranks of advanced manufacturers in the region. The Austrian company aims to start volume ramp of high-performance analog wafers by the second half of 2018.
FD-SOI Expands, But Is It Disruptive?
News & Analysis 4/14/2016 5 comments
The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
Facebook Roadmap Eyes AR/VR, Connectivity
News & Analysis 4/13/2016 2 comments
Facebook's CEO said the company will target three major areas in the next 10 years: connecting everyone to the Internet, artificial intelligence, and virtual and augmented reality.
VC Veteran Joins EDA Group
News & Analysis 4/13/2016 Post a comment
Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Machine Learning Routes Chips
News & Analysis 4/8/2016 Post a comment
The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
Developing an Accessible Arduino
News & Analysis 3/31/2016 Post a comment
Development platforms such as Raspberry Pi and Arduino have given access to many makers and entrepreneurs , providing a low-cost method to tinker and prototype. Yet such platforms lack accessibility for at least one group of people who need access to specialized devices.
EDA Group Broadens Mission
News & Analysis 3/31/2016 10 comments
The EDA Consortium renamed itself the Electronic System Design Alliance, taking on a broader role including semiconductor IP, embedded software and advanced packaging.
Layouts for Buck, Boost, and SEPIC Power Stages
Blog 3/23/2016 1 comment
A correct printed circuit board (PCB) layout is one of the most important aspects to having a successful power supply design. Non-isolated power stages are the basic building blocks of power systems. Understanding where the currents are flowing and how the high-frequency loops are constructed is the most important step.
5G mmW Models Go Open Source
News & Analysis 3/11/2016 Post a comment
In an effort to speed 5G development, NYU Wireless will provide its
channel models and measurements for cellular propagation in the millimeter wave (mmW) band as free, open source software. The simulation will help product developers understand the behavior and capabilities of the mmW radio spectrum.
Decoding Electronic Materials Genome
News & Analysis 3/8/2016 Post a comment
Obama's Material's Genome Initiative is finally bearing electronic-fruit with the University of Connecticut's machine learning algorithm for calculating the electronic characteristics of polymers.
4th ICE Age Upon Us
News & Analysis 2/25/2016 Post a comment
Mentor Graphics is claiming that it has entered the 4th ICE Age with its accelerated, deterministic in-circuit-emulation apps like accurate design-for-test.
Leti Strains to Improve FDSOI
News & Analysis 12/17/2015 Post a comment
French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
X-Pessimism: A Realistic Approach is Needed
Blog 12/8/2015 9 comments
A gate-level simulator is pessimistic when a signal does not resolve to a known logic value (0 or 1), a sign something is off. The fix can mean months of work. How can pessimism be fixed without getting too depressing?
ARM Sizes Up Moore’s Law
News & Analysis 12/7/2015 3 comments
It’s getting harder and more costly to make chips smaller and faster, but there is still hope for advancing Moore’s Law, said an ARM researcher at IEDM.
Verizon Unveils ThingSpace IoT Platform
News & Analysis 10/29/2015 Post a comment
Verizon wants to connect billions of things within the space of its 4G LTE network. The company announced an Internet of Things development platform, ThingSpace, that aims to lower the barrier to entry for connectivity in smart cities, healthcare, agriculture, energy, and sharing platforms.
Apple Gives a Foundry Lesson
Blog 10/16/2015 10 comments
The rush to analyze Apple products has led to distorted conclusions from some who fail to appreciate the nuances of semiconductor technology, says one analyst.
5nm Test Lights Litho Path
News & Analysis 10/7/2015 6 comments
Test chips made in a 5nm process showed the value of pushing today’s 193-immersion and tomorrow’s extreme ultraviolet lithography systems to their limits, said researchers at Imec and Cadence.
Put FPGAs In Your SoCs
News & Analysis 10/2/2015 5 comments
Flex Logix has a new type of FPGA that nearly doubles the number of usable gates per chip. The FPGAs eliminate more than 20% of the room needed for interconnect and switches, and now have nearly 50% more room for gates.
TSMC Preps 10nm, Tunes 16nm
News & Analysis 9/17/2015 7 comments
The world’s largest chip foundry said it will start “risk” production in 10nm late this year while it fine tunes its 16nm process and plans a basket of IoT offerings.
Dresden Memory Startup To Debut At Semicon Europa
News & Analysis 9/15/2015 5 comments
A startup company that is working on a ferroelectric non-volatile memory technology based on hafnium oxide is set to make its debut at the Semicon Europa exhibition taking place in Dresden, Germany, October 6 to 8.
Post-Silicon Tech Compared
News & Analysis 9/9/2015 4 comments
The Semiconductor Research Corporation is creating a joint benchmarking effort with Georgia Tech to guide post-silicon era electronics development at IBM, Intel, Freescale and Texas Instruments.
Flextech Guru Helps U.S. Stretch
News & Analysis 9/3/2015 2 comments
The head of a new initiative to give the U.S. a lead in flexible hybrid electronics talks about the technology, markets and politics of the $165 million effort.
Nanotech Hub Targets 7nm, Beyond
Slideshow 8/27/2015 2 comments
We toured the College of Nanoscience and Engineering, part of a State University of New York campus, a hub for advanced semiconductor manufacturing research in areas such as lithography, 450mm wafers, and new materials as well as photonics, biotech and workforce development.
Giga-Scale Challenges Plague Memory Design
Blog 8/27/2015 Post a comment
Advanced designs are more complex and larger than ever before and designers are balancing between accuracy and performance for large scale memory simulation and verification, fine-tuning options and settings for each circuit type
Intel CEO Sees A Bright Future For IoT, Developers
News & Analysis 8/19/2015 Post a comment
Tiny computers, real-time depth sensing, and breakthrough memory technology are among the innovations featured at this year's Intel Developer Forum. CEO Brian Krzanich detailed how connected devices will change the way we all do business.
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