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posted in July 2012
IC supplier, customer cooperation methodologies drive up electronics system quality
Design How-To  
7/13/2012   1 comment
Although IC manufacturers have been extremely successful in reducing defects, on the other hand a significant part of the quality drive for printed-circuit-board module makers is stemming from reducing electrical over-stress (EOS), electrostatic discharge (ESD), and cases of no-trouble-found (NTF). Solution of these problems requires the involvement of the PCB module maker and the automotive manufacturer as well.
IMS2012: Show in review
Design How-To  
7/3/2012   Post a comment
Here's a wrap-up of some of the things I saw at the IMS2012 in Montreal June 19-21st, 2012.
Advanced capacitors ensure long-term control-circuit stability
Design How-To  
7/2/2012   Post a comment
Tantalum and niobium-oxide technology meet industry needs for rugged capacitors that maintain high-performance standards under electrical and mechanical stresses. Technical improvements have been made that strengthen the structure of the capacitor and give it more robust performance in a variety of uses. And application guidelines aid design engineers.
Embedded vision: FPGAs’ next technology opportunity
Design How-To  
7/2/2012   3 comments
This article addresses the emerging application of embedded vision moving into multiple applications, including military and aerospace.


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Aloha from EEWeb
Max Maxfield
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Just a few minutes ago as I pen these words, I posted this blog about this month's Cartoon Punchline Competition over on EEWeb.com.