REGISTER | LOGIN
Breaking News
Die Handling Critical in Flex Electronics
9/29/2017

Silicon die need to slim down to new levels to meet the requirements of flexible hybrid electronics. (Source: NextFlex)
Silicon die need to slim down to new levels to meet the requirements of flexible hybrid electronics. (Source: NextFlex)

Return to Article

View Comments: Newest First | Oldest First | Threaded View
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed