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Hats Off to Hynix: Inside 1st High Bandwidth Memory

TechInsights analyzes high bandwidth memory
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jnissen
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Outstanding effort!
jnissen   7/30/2015 2:53:36 PM
NO RATINGS
Fantastic example of advanced packaging! Love the stacked die and interposer combo. You can see a significant effort went into the entire solution. Not just talking about it but you actually did it. Congratulations.

msporer
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The beginning of a whole new era!
msporer   7/28/2015 12:34:04 PM
In an industry where innovation has been largely achieved by riding the coattails of Moore's law, this is truly a breakthrough. When one company proves something can be done (HMC/Micron) it is usually considered a "science project", but when other companies deliver, such as (HBM/SK Hynix) and (3DS/Samsung), all built with TSV die stacking, it is clearly the path forward.

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