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FO-WLP Packs Eye Panel Process

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sranje
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Re: are there any limits to using FO WLPs for APs and CPUs
sranje   8/29/2016 11:28:12 AM
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Dear Chipmonk-0,

Perhaps I read you too accurately and that was my mistake --- your question specifically asked -- in production


So I responded - without meaning to insult you.    About paper-pitched limits of not yet confirmed by reality (i.e., HV production) we can theorize for a long time.

There is a world of difference between paper-products and high-volume production with extremely high yields...

Peace and - with great respect, faithfully your humble Scum

chipmonk0
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Re: are there any limits to using FO WLPs for APs and CPUs
chipmonk0   8/29/2016 11:12:33 AM
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@ sranje : my question was a technical one meant to be replied by the technically literate not by some rude scum that merely keeps up with Apple rumors. FYI the soon to be revealed A10 die is not the current upper bound for FO WLPs, it is merely a datapoint that any superficial and supercilious scum would consider to be the ultimate piece of evidence. 

sranje
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Re: are there any limits to using FO WLPs for APs and CPUs
sranje   8/27/2016 12:17:05 PM
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Sure - no offense meant.  Even my cat knows the answer to your question since Apple's iPhone-7 processor size - the only one in production - is well documented

      What is the max size of CPUs or APs now in production with FO WLPs ?

Or maybe I misunderstand your comments / question....

 

chipmonk0
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Re: are there any limits to using FO WLPs for APs and CPUs
chipmonk0   8/17/2016 2:13:25 PM
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@ sranje : can you please explain why you thought my question as silly ? are you an expert in the technology being discussed here ? 

sranje
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Re: are there any limits to using FO WLPs for APs and CPUs
sranje   8/17/2016 12:37:27 PM
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Do silly questions realy require an answer?

chipmonk0
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are there any limits to using FO WLPs for APs and CPUs
chipmonk0   8/16/2016 4:09:47 PM
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the article states :

" FO-WLP for application processors is a gamer changer compared with traditional flip chip on laminate substrates found in package-on-package (PoP) because a substrate is no longer required. "

but don't you lose something by not using substrates any more ?

after all substrates should somewhat isolate the chip from stresses from the Motherboard, even in Smart Phones.

Would n't stress be an issue in the chip part of a FO WLP attached face down directly to the Motherboard since the chip will be very close to the Motherboard ?

What is the max size of CPUs or APs now in production with FO WLPs ?

Are those sizes included in these Panel projects ?

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