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DARPA Calls For 50X Improvement in SoC

Detailed in the 3DSoC Program
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Or_Bach
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Re: What about thermals?
Or_Bach   10/15/2017 10:19:43 PM
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As stated before this is engineering challange. 3D NAND are coming soon with 96 layers as comercail high volume products (It is a bit more than 3-4 layers). In IEDM 2012 we had presented a joint work with Stanford, of an effective technology to remove the heat from the inner layers of monolithic 3D devices. <http://www.monolithic3d.com/blog/category/heat%20removal%20and%20power%20delivery>

Note - in monolithic 3D, the layers are very thin and the distance to the external surface for heat removal, is accordingly very short (few microns).

GroovyGeek
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Re: What about thermals?
GroovyGeek   10/15/2017 7:13:17 PM
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Yes but 3D makes is a challenge even in situations where there are solutions for 2D.  You need to stick your heat generating layers on the outside of the stack, which means by the time you reach 3-4 layers you are more or less done with stacking.

Or_Bach
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Re: What about thermals?
Or_Bach   10/15/2017 6:59:47 PM
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Thermal is an engineering challange of IC in general both in 2D and in 3D. Interconnects are the main source of the thermal challange and monolithic 3D is the best solution.  

GroovyGeek
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What about thermals?
GroovyGeek   10/15/2017 6:43:11 PM
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All this is fine and dandy, except at least as presented here nobody is talking about thermal dissipation, which is the real elephant in the room.  Monolithic 3D integration is, in many ways, a solved problem, at least from a process technology standpoint.  It is already a reality in image sensors, you can buy a 3-layer Sony sensor today... except that the computational workload is much lower than that of a continuously operating CPU/GPU/TPU.

Or_Bach
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Re: The Time has Come
Or_Bach   10/12/2017 10:50:58 PM
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So very trure, Just few month ego we could read at EE Times: "Calling for 100x faster processors, China Web giant Baidu released DeepBench" And in article by Rick Merritt titled: "Google Searches for Better Silicon" quoting: " "The slowdown in Moore's law and the growth of cloud services has brought us to an inflection point," said Prasad Sabada, a senior director of operations who oversees sourcing for Google's data center hardware. "The game is changing again and we need the industry to respond in a meaningful way."...Google also wants memory chips with lower latency. "We can get as much bang for the buck improving memory latency as processor performance,"

bec0
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The Time has Come
bec0   10/12/2017 10:03:47 PM
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AI is being talked about as the next BIG THING. DARPA wants systems that the AI industry will need. Traditional scaling will not meet the requirements...not even close. Monolithic 3D ICs look like the most straightforward and easiest to manufacture of the potential solutions out there or even on the drawing boards. Time for the industry to make monolithic ICs happen. Whoever is first will make the dough.....who will that be? Intel? TSMC? Global? China? 

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