A 5G interoperability test system developed by Qualcomm, ZTE and China Mobile, combined with the pending development of the first 3GPP 5G-NR standard, are good indicators of the pending frenzy over 5G; it’s a good time to take a Boot Camp course on 5G.
A trio of articles explain how QSFP-DD and MicroQSFP connectors high-speed connectors handle excess heat and what engineers must do the minimize EMI.
Not everyone believes that a robo-shuttle/truck crash in Las Vegas was just a minor glitch. Did those involved in the operation and design of the AV shuttle carry out enough of an in-depth risk assessment of the area?
Microchip Technology demonstrates its infotainment connectivity solution at the 2017 ELIV electric vehicle conference in Bonn, Germany
Integration of eFPGA into microcontrollers is happening today now that this technology is available from multiple suppliers in 180nm to 16nm process nodes.