London Wisair Ltd. (Tel Aviv, Israel) has raised $15.5 million in second-round funding that it will use to accelerate its development of ultrawideband chip sets and reference designs and to expand its global sales and marketing operations.
Wisair is a member of the Multiband-OFDM Alliance, which advocates a multiband, frequency-hopping approach for
a physical layer interface for UWB communications. The IEEE.802.15.3a study group is moving to standardize a UWB interface.
Another UWB chip startup, Artimi Ltd., also announced receipt of additional funding last week .