SANTA CLARA, Calif. -- Power semiconductor maker Ixys Corp. has introduced an aluminum-based interconnection and substrate technology that it calls Direct Aluminum Bonded or DAB. DAB is intended for the creation of high-power devices and multi-die power modules for use in demanding automotive, aerospace and industrial applications, the company said.
The DAB technology is a more advanced alternative to the Direct Copper Bonded technology, which has been used for the production of integrated power semiconductor modules in the past, Santa Clara-based Ixys claimed.
Direct metal bonded packaging has conventionally used copper as the main conductor, which is then bonded to alumina or aluminum nitride ceramics. In the DAB technology, aluminum is used as the conductor because it can form a more rugged and reliable bond to the ceramic, Ixys said in a statement. This in turn results in better thermal cycling performance as demanded by critical power control applications in automotive, aerospace and industrial applications, the company said.
The aluminum layer is patterned much the same way that copper is patterned in a standard DCB and on printed circuit boards, and is plated with solderable metals for ease of use. DAB substrates are also lighter than their DCB counterparts, offering 37% to 64% weight savings as a substrate, the company said.
"We have already shipped DAB substrates to our customers, and are in the process of expanding the product line," commented Ron Sherwood president of Directed Energy Inc., Ixys' wholly owned subsidiary in Colorado that manages the sales of DCB and DAB substrates. "The unique properties of our DCB and DAB are listed in our new product flier, and allows the user to choose the substrate of choice. For mission critical applications with expanded temperature cycling requirements we recommend DAB."