COLORADO SPRINGS, Colo. -- Simtek Corp. here today announced an expansion of its field-programmable gate array (FPGA) replacement series to include ICs housed in ball-grid array (BGAs) packages with contacts counts as high as 900 balls.
The FPGA replacement parts are available in BGAs with contact pitches ranging between 1.0 to 0.5 mm. The packages can be as thin as 1.2 mm. Between 40 to 900 contacts are available for I/O, ground and power suppliers.
Simtek said it can typically deliver prototypes eight weeks from receipt and approval of FPGA design archive files from customers using FPGAs supplied by Xilinx, Altera, Lattice and other vendors. Simtek claims that the cost savings will be least 50% when compared to original FPGA devices.