SAN JOSE -- Silicon Genesis Corp. (SiGen) today (October 31, 2003) announced it has licensed its new plasma-activated bonding technology to EV Group, a chip-equipment maker based in Scharding, Austria.
EV Group has obtained a license for SiGen's NanoBond technology. This technology allows for up to 30 times greater bond strengths than conventional wet bonding techniques, according to SiGen of San Jose. The process is geared for silicon-on-insulator (SOI), MEMS, and other laminated electronic applications.
EV Group's wafer bonding systems will now provide this technology, of which it calls "LowTemp Dry Activated Plasma Bonding." By applying the plasma activation, the surface chemistry of two materials to be bonded can be tailored to allow formation of stronger chemical bonds than achievable for non-activated surfaces. This leads to a significant decrease of the annealing temperature and annealing time.
"The bond processes now offered by EVG can address a wide range of applications due to its flexibility in bond optimization made possible by the variety of plasma gases, pressures and other parameters available," said Francois Henley, founder and CEO of SiGen. "This license is consistent with our recent transition to focus on licensing, protecting and strengthening our intellectual
Earlier this month, SOI wafer supplier SiGen disclosed plans to exit the manufacturing side of the business, thereby focusing its efforts on becoming a fabless intellectual-property (IP) house. SiGen is now transitioning from an IP company with wafer production to a fabless IP company. Going forward, the San Jose-based company will focus on licensing its SOI and strained-silicon technologies to volume manufacturing partners and continuing IP development for next generation products (see October 3 story).