MANHASSET, N.Y. " Intersil Corp. said it will move its 0.6-micron BiCMOS wafer processing production to IBM Corp.'s Burlington, Vt., manufacturing facility following an expansion of a September 2003 foundry services agreement between the two companies.
Currently, 0.6-micron high-performance analog products are being produced using the same BiCMOS process at both Intersil's 6-inch and IBM's Burlington 8-inch fabs.
The move will allow Intersil (Milpitas, Calif.) to focus its entire Palm Bay, Fla., manufacturing capacity to standard analog products fabricated on its greater than 1-micron proprietary processes made on its 4- and 6-inch wafer lines.
Intersil said it will concentrate its internally developed 0.6-micron production exclusively at IBM over the next six to nine months. All 0.6-micron wafer processing will be handled at the IBM foundry before the end of 2004.
"IBM has done a superb job for us and it makes sense to consolidate our 0.6 micron production on their 8-inch line," said Rich Beyer, Intersil's president and CEO.