SAN FRANCISCO—Japanese semiconductor equipment vendor Tokyo Electron Ltd. (TEL) said Friday (March 16) it signed a definitive agreement to acquire Nexx Systems Inc., a supplier of physical vapor deposition tools for thin films and electrochemical deposition tools for metals. Financial terms of the transaction were not disclosed.
TEL (Tokyo) said it has collaborated with Nexx (Billerica, Mass.) to study process technology in advanced packaging equipment for the development of 3-D through silicon vias (TSV). Nexx will be operated as a wholly owned subsidiary of TEL, the company said.
"Nexx has demonstrated outstanding advantages in electrochemical deposition, a key differentiating technology in this market," said Hiroshi Takenaka, TEL's president and CEO, in a statement. "TEL's strategy to advance wafer level packaging will make use of technical synergies only possible between these two companies and will capitalize on both TEL and Nexx's core business strengths."