The packaged transceiver
operates at frequencies in the range of 90-94GHz, according to IBM. It
is implemented as a unit tile, integrating four phased array ICs and 64
By tiling packages next to one another
on a circuit board, scalable phased arrays of large aperture can be
created while maintaining uniform antenna element spacing, according to
IBM. The beamforming capabilities enabled by hundreds of antenna
elements will allow for communications and radar imaging applications
that will extend over a range of kilometers.
Each of the four
phased-array ICs in a tile integrates 32 receive and 16 transmit
elements with dual outputs to support 16 dual polarized antennas,
according to IBM. Multiple operating modes are supported, including the
simultaneous reception of horizontal and vertical polarizations, IBM
Packaged view of the integrated circuit. The above photo depicts the size of the millimeter wave chip. Each of the 64 diamond shaped objects is an antenna. The spacing of these antennas is exact and allows for additional chips to be aligned next to the above one and expand the array.
The new ICs are fabricated using IBM's silicon-germanium process.
spans 30 GHz to 300 GHz on the electromagnetic spectrum, 10 to 100
times higher than the frequencies used for mobile phones and Wi-Fi,
according to IBM. Frequencies in the range of 90-94GHz are well suited
for short and long range, high-resolution radar imaging, the firm said.
94GHz radar imaging technology could alleviate difficulties for
aircraft pilots navigating through weather, debris and other vision