MUNICH, Germany Fabless chip vendor Dialog Semiconductor plc (Kirchheim, Germany) succeeded in attracting 3C vendor Asustek as a customer. The Taiwanese company plans to equip its next-generation smartphones with two Dialog ASSPs.
The ASSPs supplied by Dialog Semiconductor integrate power management and audio interface functions as well as an RF interface, the company said.
Dialog and Asustek have already cooperated during the past two years. After the insolvency of BenQ mobile as one of its main customers, Dialog had a tough time, realigning its product portfolio and alluring new customers. Asustek's move can be regarded as a step into this direction. Besides Asustek, also telecommunications equipment manufacturer Ericsson is using Dialog's power management chips.