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FPGA-based instrumentation withstands chill in deep space

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LJL1
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re: FPGA-based instrumentation withstands chill in deep space
LJL1   9/13/2012 6:47:09 AM
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One might expect that the differential shrinking between metal and silicon would cause broken traces on the die. Can you say whether or not this may have happened?

elektryk321
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re: FPGA-based instrumentation withstands chill in deep space
elektryk321   9/13/2012 7:55:54 AM
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High temperature makes problems with silicon devices by fast electrons movement and power dissipation. Low temperature makes no problem for silicon design itself, but for mechanical design like wiring inside package, crystal oscillators or electrical interconnects. I do not feel this mechanical problems are big deals for any other IC manufacturers.

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