Palo Alto, Calif. Agilent Technologies Inc. said it has introduced the industry's smallest ChipLED surface-mount LEDs (light-emitting diodes) for next generation mobile phones and PDAs.
Used in applications such as LCD and keypad backlighting, Agilent's HSMx-C120 series LEDs are available in a wide variety of colors and in a range of die technologies. These include AlInGaP (aluminum indium gallium phosphide) in 572 nm green, 592 nm amber, 605 nm orange and 626 nm red; AlGaAs (aluminum gallium arsenide) 639 nm red, GaP (gallium phosphide) in 572 nm green, 604 nm orange and 626 nm red; and InGaN (indium gallium nitride) in 473 nm blue and 527 nm green.
Typical luminous intensities range from 8 millicandelas (mcd) (GaP orange) to 145 mcd (InGaN green) at 20 mA. The surface-mount ChipLED package features precision dimensions to ensure precise pickup by automated manufacturing equipment and compatibility with IR reflow soldering, said the company.
The new HSMx-C120 series surface-mount LEDs, with dimensions of 1.6 (L) x 1.0 (W) x 0.6-mm (H), are compatible with the industry-standard 0603 footprint. The height of the LEDs is 0.5-mm smaller than most competitive packages, said the company. The devices offer a wide operating temperature range of -30°C to 85°C.
These LEDs may also be used in other applications such as office and industrial automation, consumer appliances, networking and medical instruments.
Packaged on 8-mm carrier tape on 7-inch (178-mm) diameter reels and sealed in moisture barrier bags, the ChipLEDs are priced at $0.08 to $0.40 each in quantities of 1,000. They are available direct from Agilent or its worldwide distribution partners.
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