PORTLAND, Ore. — Imec (formerly Interuniversity Microelectronics Centre in Leuven, Belgium) is now taking orders for its 28 gigabit per second silicon photonics platform for optical interconnects and other optical applications. A cooperative effort of ePIXab (Ghent University), Europractice IC, and Mosis, the next wafer run will include the latest upgrades to Imec's developing photonics platform, including support and a registration design kit.
The next wafer run is due out in January 2015 (deadline September 15, 2014), followed by another run in June 2015 (deadline November 10, 2014).
Imec's on-going silicon photonics platform (iSiPP25G) includes the key subsystems for building high-density low-power wavelength-division multiplexed (WDM) which it has recently improved to 28 gigabits per second with thermal tuning whose efficiency rates exceed 260pm per milliWatt. The ring-based topology includes improved thermo-optic turning efficiency of one nanometer per milliWatt per channel. A high-speed germanium photodetector responds at 0.85A per Watt. And an opto-electrical bandwidth of 50-gigaHertz has reduced dark currents to below 50 nanoAmps at -1.0 volts.
The wafer-scale silicon photonics complements Imec's silicon photonics portfolio, which includes low-loss (less than 2.5dB per centimeter) strip waveguides, efficient grating couplers with just 2.5dB insertion loss, and 25Gb/s Mach-Zehnder modulators.
The silicon photonics platform is designed for fabless research and development teams, providing a cost-effective integrated solution for telecom and data com applications, including Imec's high-performance optical transceivers.