In my opinion, I am sure that all of the companies you mention would like to ask for money up front. I am not sure that they can. ASML holds all of the cards in litho. I am not sure any other company would be negotiating from such a position of strength.
I think ASML has a duty to shareholders to announce any (share) price sensitive information. 300mm EUV R&D is done in all but power source/throughput (?). Intel wants 450mm EUV and 450mm ArF,KrF and immersion. This is the beginning of the end for Nikon, Intels traditional lithography partner. My money is on TSMC & Samsung to follow Intel's move.
EUV is part of the deal. But phase one is 450. I think that is what Intel wants more. Intel's Yan Borodovsky spoke today about using complementary lithography, including 193 immersion, DSA and perhaps other technologies. But I think Intel is just trying to cover its bases. Intel still wants EUV badly. But it seems to me that the jury is still out on EUV's economic viability.
this is a desperate move by intel.
I bet the windows 8 news drive it crazy. it commands maybe 1% tablet market now, and imagine
2-3 year later 50% desktop will be intel nonrelated, with it's cost structure it's doomed.
the proliferation of 28-40nm at foundrys is making all these possible.
intel is trying to command some advantage as it used to have by doing this, oh well, this time it might not work, it just smells like kodak.