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Or_Bach
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Re: tremendous 3D integration
Or_Bach   12/30/2013 11:17:49 AM
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Monolithic 3D does provide cost reduction ! Please note that not all 3D are alike. TSV base 3D does not provide cost reduction, but monolithic 3D does, you could get more details why and how in: <http://www.monolithic3d.com/3d-ic-edge1.html>. Clearly the number one advantage of all 3D NAND which are now reaching mass production is cost reduction !, similarly CEA Letri announcment of their agreement with Qualcomm for the development of monolithic 3D states that 3D provide the benifits of dimension scaling.   

wilber_xbox
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Re: tremendous 3D integration
wilber_xbox   12/30/2013 10:27:03 AM
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3D integration will not lead to traditional cost-effective method of chip density. Rather it will add to more cost so the benefits will be limited to the technology only.

chipmonk0
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Re: tremendous 3D integration
chipmonk0   12/19/2013 11:22:37 AM
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We have heard these grand pronouncements from this individual before. The last I remember was on HKMG gate last ( Intel, the incumbent ) or first ( consortia of Foundries led by Big Blue ). After inevitable problems surfaced with gate first, Samsung & TSMC got burnt and had to go back to gate last and was delayed by a couple of quarters. Credibiiity gap galore.

Or_Bach
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tremendous 3D integration
Or_Bach   12/18/2013 1:00:58 AM
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Yes, the future is 3D integration, and now that it is practical monolithic 3D IC provide by far the best 3D integration. And quoating Meyerson: 

"It'll look like a single chip, but it will be about 50 chips stacked one on top of the other."

The additional advantage monolithic 3D provides is the ability to process many of those layer in one step, just like they do in 3D NAND, providing tremendous cost benifits.



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