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rleckie
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Other solutions...
rleckie   3/14/2017 6:56:58 PM
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Paula - It is worth mentioning the work we are doing in CAST on RITdb and TEMS.  Those are two new standards being proposed for data management at Test - but could just as easily be adapted to apply to any aspect of the semiconductor manufacturing chain.  

http://www.semi.org/en/sites/semi.org/files/data15/docs/CAST%20RITdb%20WG%20Update%20July%202015.pdf

http://www.semi.org/en/sites/semi.org/files/data15/docs/CAST%20TEMS%20WG%20Update%20July%202015.pdf

Regards,

 

Ron

PaulaDoe
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Drivers for interest in communications in assembly
PaulaDoe   3/13/2017 7:49:16 PM
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Just to clarify, it's the move to BGA and CSP packaging with bare die and flip chip attachment that are driving the assembly business to need more chip-like equipment and communications --as well as their systems customers' interest in more visibility into their supply chain



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